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Flyboat lightning-chip varistor (MOV) low-cost irrigation glue Description
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Updated£º2009-11-29 16:10:14
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¡¡¡¡To solve the pressure-sensitive mine-chip low-cost epoxy resin casting, I specifically purchased the company in Tianjin Jinqiao Insulation Materials Co., Ltd. tens of kilograms TXH-1156 epoxy potting material, will be my company in 2006 in the first half of approved sub-products remaining extract a few pieces of each sample to 10 the number of films of epoxy potting test results the following table: (left sample has been due to the long putting-damp, encapsulation is not carried out before the drying processing)

Chip Lot
Potting ago Parameters
Casting process
 5 days curing parameters
 15 days curing parameters
 Notes
U 1mA
I L (¦ÌA)
U 1mA
I L (¦ÌA)
U 1mA
I L (¦ÌA)
 0601-1
 615V
8.3
 120ml gel +30 ml curing agent (volume ratio 4:1, weight ratio 100:10), and mix thoroughly 8min, room temperature curing.
 616V
7.3
617
6.2
608V
11.4
611V
9.5
610
9.1
632V
6.4
626V
5.8
625
5.0
 637V
7.4
638V
6.5
639
6.0
 0603-3
 702V
10.5
703V
9.3
705
8.4
705V
18.1
712V
14.0
709
12.6
716V
18.7
722V
17.6
720
15.5
705V
13.3
708V
8.4
707
7.8
 725V
16.9
729V
15.1
728
13.6
 0604-1
705V
12.4 
704V 
10.1
706
9.4
 693V
8.6
692V
6.4
695
6.5
716V
18.7
713V
15.2
716
13.3
 0604-5
673V
7.5
 673V
6.7 6.7
674 674
6.3
676V
13.5
 677V
11.3
677 
10.8 
 669V
7.2
 670V
6.1
671
5.8
 660V
10.6
661V
8.8
664
8.8
666V
9.7
667V
7.1
667
6.7 
0605-A2
664V
6.2
 200ml gel +40 ml curing agent (volume ratio 5:1, weight ratio of 100:8), and mix thoroughly 10min, room temperature curing.
656V
4.5
659
3.6
670V
16.5
667V
5.7
668
5.4 
657V
13.0
653V
5.1
647
5.1
663V
8.0
660V
5.1
659
5.0.
663V
8.6
663V
5.8
654
5.8
652V
8.8
652V
5.6
663
5.4
666V
5.1
 660V
5.0
653
5.0

¡¡¡¡The results can be seen from the above: As long as the proportion of appropriate technology is correct, can be used to reduce the user-made epoxy resin casting cost (the other properties of rubber user-authentication). My company filling plastic processes are as follows:
¡¡¡¡Before the first chip encapsulation under 120 ¡æ drying 30 to 60 minutes; rubber, curing agent in accordance with 5:1 volume ratio (100g: 8g = 8ml weight ratio) with a good mix thoroughly, and mix thoroughly how to adjust the amount of time under the gum, but it should be ensure the full mix well; and then proceed to filling glue. Kaifeng, a longer time if the glue should be heated to glue 80 ~ 100 ¡æ, thermal insulation of about 30min in order to drive out moisture, cooling and curing agent and then allocated in proportion to the use of a good mix thoroughly.  Potting after basic curing the product placed in the oven for 85 ~ 100 ¡æ heat insulation 30 ~ 60 minutes.
¡¡¡¡Use of other adhesive is also important to note that the user reduce the ratio of curing agent is generally from the manufacturers recommended ratio of 1 / 2 or so begin to try and curing agent dosage should not exceed manufacturer¡¯s recommended maximum ratio of 2 / 3.
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 Address£ºThe 4th floor ,2#standard factory building, National Hi-Tech Industrial District Jinyang Science and Technology Park, Guiyang City, Guizhou Province, PRC ¡¡ Zip:550006 ICP Record Number£ºÇ­ICP±¸¡ª05002044ºÅ
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